Micron 7450 PRO U.3 15.4 TB PCI Express 4.0 3D TLC NAND NVMe

SKU
MTFDKCC15T3TFR-1BC1ZABYYR
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In Stock
15360GB, U.3, 3D TLC NAND, PCIe Gen4 1x4, NVMe 1.4, Non-SED
More Information
SSD form factor U.3
Hardware encryption Yes
Memory type 3D TLC NAND
SSD capacity 15360 GB
SKU MTFDKCC15T3TFR-1BC1ZABYYR
EAN 0649528926265
Manufacturer Micron
Availability In Stock
The Micron 7450 SSD with NVMe™ is the world’s most advanced 176-layer NAND data center SSD, delivering exceptional latency and PCIe Gen4 with extensive deployment options.

World’s Most Advanced NAND in a Data Center SSD
The Micron 7450 SSD enables flexible cloud and data center designs to support a wide variety of workloads.

The 7450 SSD is built on Micron’s state-of-the-art, 176-layer NAND. Available in the broadest range of PCIe® Gen4 SSD form factors enabling you to use the Micron 7450 for all major platform functions (boot, cache and main data storage). The Micron 7450 SSD consistently delivers 2ms and lower latency for 99.9999% QoS1 and offers next-generation security features such as Micron’s unique Secure Execution Environment.2 It is designed for high-capacity SSD needs and includes a PCIe Gen4 M.2 22x80mm with power-loss protection model — specifically designed for server boot use.

Improves Storage Performance Across Data Center Workloads
The Micron 7450 SSD utilizes Micron's innovative 176-layer NAND, which combines the highest layer count with Micron CMOS-under-array technology and PCIe Gen4 to provide industry-leading performance,3 enabling faster booting and improved application responsiveness.

Enables Rapid, Reliable and Responsive Data Center Workloads
The Micron 7450 SSD consistently delivers 2ms and lower latency for 99.9999% QoS4 improving performance in databases such as Microsoft SQL Server, Oracle, MySQL, RocksDB, Cassandra and Aerospike.5

Supports a Wide Variety of Data Centers - Reducing Qualification Time, Cost and Complexity
Capacities range from 400GB to 15.36TB5— including an industry-leading 8TB E1.@ capacity and a new 15.36TB capacity. It has the industry’s broadest variety of form factors to meet evolving power and thermal needs — U.3, M.2, E1.S — including the only PCIe Gen4 U.3 SSD with both 15mm and 7mm thicknesses available.
Hard drive
PCI Express interface data lanesx4
SSD capacity15.4 TB
Memory type3D TLC NAND
Data transmission
Random write (4KB)250000 IOPS
Random read (4KB)1000000 IOPS
Write latency15 µs
Read latency80 µs
Endurance
Uncorrectable Bit Error Rate (UBER)< 1 per 10^17 bits read
Performance
InterfacePCI Express 4.0
Component forServer/workstation
NVMeYes
NVMe version1.4
PCI Express interface data lanesx4
SSD capacity15.4 TB
Memory type3D TLC NAND
Uncorrectable Bit Error Rate (UBER)< 1 per 10^17 bits read
Random write (4KB)250000 IOPS
Random read (4KB)1000000 IOPS
Write latency15 µs
Read latency80 µs
Hardware encryptionYes
Design
Component forServer/workstation
SSD form factorU.3
Features
InterfacePCI Express 4.0
Component forServer/workstation
NVMeYes
NVMe version1.4
PCI Express interface data lanesx4
SSD capacity15.4 TB
Memory type3D TLC NAND
Uncorrectable Bit Error Rate (UBER)< 1 per 10^17 bits read
Random write (4KB)250000 IOPS
Random read (4KB)1000000 IOPS
Write latency15 µs
Read latency80 µs
Hardware encryptionYes
SSD form factorU.3
Target workloadRead Intensive (RI)
Operational conditions
Operating temperature (T-T)0 - 70 °C
Technical details
InterfacePCI Express 4.0
Operating temperature (T-T)0 - 70 °C
Hardware encryptionYes
SSD form factorU.3
Other features
Uncorrectable Bit Error Rate (UBER)< 1 per 10^17 bits read

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SKU
MTFDKCC15T3TFR-1BC1ZABYYR
SSDPE21K750GA01
C9K-F1-SSD-240G=
R0Q47A
R0Q46A
MZILG15THBLA-00A07
Manufacturer
Micron
Intel
Cisco
HPE
HPE
Samsung
Memory type
3D TLC NAND
3D Xpoint
N/A
N/A
N/A
V-NAND
SSD capacity
N/A
500GB to 800GB
200GB to 250GB
1200GB to 2000GB
800GB to 1000GB
N/A
SSD form factor
U.3
U.2
N/A
2.5"
2.5"
2.5"
Interface
PCI Express 4.0
PCI Express 3.0
Serial ATA
SAS
SAS
SAS
Component for
Server/workstation
PC/notebook
Network switch
Disk array
Disk array
Server/workstation